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AD7823 数据手册DataSheet 下载

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AD7823 数据手册DataSheet 下载
a
FEATURES
8-Bit ADC with 4 ␮s Conversion Time
Small Footprint 8-Lead microSOIC Package
Specified Over a –40ⴗC to +125ⴗC Temperature Range
Inherent Track-and-Hold Functionality
Operating Supply Range: 2.7 V to 5.5 V
Specifications at 2.7 V to 5.5 V and 5 V ⴞ 10%
Microcontroller Compatible Serial Interface
Optional Automatic Power-Down
Low Power Operation:
570 ␮W at 10 kSPS Throughput Rate
2.9 mW at 50 kSPS Throughput Rate
Analog Input Range: 0 V to V REF
Reference Input Range: 0 V to VDD
“Drop In” Upgrade to 10 Bits Available (AD7810)
2.7 V to 5.5 V, 5 ␮s, 8-Bit
ADC in 8-Lead microSOIC/DIP
AD7823
FUNCTIONAL BLOCK DIAGRAM
VDD
VREF
AGND
AD7823
CHARGE
REDISTRIBUTION
DAC
SERIAL
PORT
DOUT
SCLK
CLOCK
OSC
VIN+
VIN–
COMP
VDD /3
CONTROL
LOGIC
CONVST
APPLICATIONS
Low Power, Hand-Held Portable Applications
Requiring Analog-to-Digital Conversion
with 8-Bit Accuracy, e.g.,
Battery-Powered Test Equipment
Battery-Powered Communications Systems
www.BDTIC.com/ADI
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The AD7823 is a high speed, low power, 8-bit A/D converter
that operates from a single 2.7 V to 5.5 V supply. The part contains a 4 µs typ successive approximation A/D converter, inherent
track-and-hold functionality (with a pseudo differential input)
and a high speed serial interface that interfaces to most microcontrollers. The AD7823 is fully specified over a temperature range
of –40°C to +125°C.
1. Complete, 8-Bit ADC in 8-Lead Package
The AD7823 is an 8-bit 4 µs typ ADC with inherent trackand-hold functionality and a high speed serial interface—all
in an 8-lead microSOIC package. VREF may be connected to
VDD to eliminate the need for an external reference. The result
is a high speed, low power, space saving ADC solution.
By using a technique that samples the state of the CONVST
(convert start) signal at the end of a conversion, the AD7823
may be used in an automatic power-down mode. When used in
this mode, the AD7823 powers down automatically at the end
of a conversion and “wakes up” at the start of a new conversion.
This feature significantly reduces the power consumption of the
part at lower throughput rates. The AD7823 can also operate in
a high speed mode where the part is not powered down between
conversions. In this high speed mode of operation, the conversion time of the AD7823 is 4 µs typ. The maximum throughput
rate is dependent on the speed of the serial interface of the
microcontroller.
The part is available in a small, 8-lead 0.3" wide, plastic dual-inline package (mini-DIP); in an 8-lead, small outline IC (SOIC);
and in an 8-lead microSOIC package.
2. Low Power, Single Supply Operation
The AD7823 operates from a single 2.7 V to 5.5 V supply and
typically consumes only 9 mW of power. The power dissipation can be significantly reduced at lower throughput rates by
using the automatic power-down mode, e.g., at a throughput
rate of 10 kSPS the power consumption is only 570 µW.
3. Automatic Power-Down
The automatic power-down mode, whereby the AD7823
“powers down” at the end of a conversion and “wakes up”
before the next conversion, means the AD7823 is ideal for
battery powered applications. See Power vs. Throughput
Rate section.
4. Serial Interface
An easy to use, fast serial interface allows connection to most
popular microprocessors with no external circuitry.
REV. C
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
World Wide Web Site: http://www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 2000
AD7823–SPECIFICATIONS (GND = 0 V, V
Parameter
REF
= VDD. All specifications –40ⴗC to +125ⴗC unless otherwise noted.)
Y Version
Unit
48
–70
–70
dB min
dB typ
dB typ
–77
–77
dB typ
dB typ
8
± 0.5
± 0.5
±1
±1
±1
Bits
LSB max
LSB max
LSB max
LSB max
LSB max
8
Bits
0
VREF
±1
15
V min
V max
µA max
pF max
Input Leakage Current
Input Capacitance
1.2
VDD
±1
20
V min
V max
µA max
pF max
LOGIC INPUTS2
VINH, Input High Voltage
VINL, Input Low Voltage
Input Current, IIN
Input Capacitance, CIN
2.0
0.4
±1
8
V min
V max
µA max
pF max
LOGIC OUTPUTS
Output High Voltage, VOH
Output Low Voltage, VOL
High Impedance Leakage Current
High Impedance Capacitance
2.4
0.4
±1
15
V min
V max
µA max
pF max
CONVERSION RATE
Conversion Time
Track/Hold Acquisition Time1
4
100
µs typ
ns max
POWER SUPPLY
VDD
IDD
2.7–5.5
3.5
Volts
mA max
17.5
mW max
1
5
µA max
µW max
54
540
2.7
µW max
µW max
mW max
DYNAMIC PERFORMANCE
Signal to (Noise + Distortion) Ratio1, 2
Total Harmonic Distortion1
Peak Harmonic or Spurious Noise1
Intermodulation Distortion2
2nd Order Terms
3rd Order Terms
DC ACCURACY
Resolution
Relative Accuracy1
Differential Nonlinearity (DNL)1
Gain Error1
Offset Error1
Total Unadjusted Error1
Minimum Resolution for Which
No Missing Codes Are Guaranteed
ANALOG INPUT
Input Voltage Range
Input Leakage Current2
Input Capacitance2
REFERENCE INPUTS2
VREF Input Voltage Range
Test Conditions/Comments
fIN = 30 kHz, fSAMPLE = 133 kHz
fa = 48 kHz, fb = 48.5 kHz
www.BDTIC.com/ADI
Power Dissipation
Power-Down Mode
IDD
Power Dissipation
Automatic Power Down
1 kSPS Throughput
10 kSPS Throughput
50 kSPS Throughput
Typically 10 nA, VIN = 0 V to VDD
ISOURCE = 200 µA
ISINK = 200 µA
See DC Acquisition Section
For Specified Performance
Sampling at 133 kSPS and Logic
Inputs @ VDD or 0 V. VDD = 5 V
Nominal Supplies
Nominal Supplies
VDD = 3 V
NOTES
1
See Terminology.
2
Sample tested during initial release and after any redesign or process change that may affect this parameter.
Specifications subject to change without notice.
–2–
REV. C
AD7823
TIMING CHARACTERISTICS1, 2 (–40ⴗC to +125ⴗC, unless otherwise noted)
Parameter
VDD = 5 V ⴞ 10%
VDD = 3 V ⴞ 10%
Unit
Conditions/Comments
t1
t2
t3
t4
t5 3
t6 3
t7 3
t83, 4
5
20
25
25
5
10
5
20
10
1.5
5
20
25
25
5
10
5
20
10
1.5
µs (max)
ns (min)
ns (min)
ns (min)
ns (min)
ns (max)
ns (max)
ns (max)
ns (min)
µs (max)
Conversion Time Mode 1 Operation (High Speed Mode)
CONVST Pulsewidth
SCLK High Pulsewidth
SCLK Low Pulsewidth
CONVST Rising Edge to SCLK Rising Edge Set-Up Time
SCLK Rising Edge to DOUT Data Valid Delay
Data Hold Time after Rising Edge SCLK
Bus Relinquish Time after Falling Edge of SCLK
tPOWERUP
Power-Up Time
NOTES
1
Sample tested to ensure compliance.
2
See Figures 14, 15 and 16.
3
These numbers are measured with the load circuit of Figure 1. They are defined as the time required for the o/p to cross 0.8 V or 2.4 V for V DD = 5 V ± 10% and
0.4 V or 2 V for V DD = 3 V ± 10%.
4
Derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then extrapolated back
to remove the effects of charging or discharging the 50 pF capacitor. This means that the time quoted in the Timing Characteristics, t8, is the true bus relinquish time
of the part and as such is independent of external bus loading capacitances.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
(TA = 25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND
(CONVST, SCLK) . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
Digital Output Voltage to GND
(DOUT) . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
VREF to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
Analog Inputs
(VIN+, VIN–) . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 125°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . 260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 56°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
MicroSOIC Package, Power Dissipation . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
www.BDTIC.com/ADI
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Model
Linearity
Error
Temperature
Range
AD7823YN
AD7823YR
AD7823YRM
± 1 LSB
± 1 LSB
± 1 LSB
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
Branding
Information
Package
Option*
C2Y
N-8
SO-8
RM-8
*N = plastic DIP; RM = microSOIC; SO = small outline IC (SOIC).
IOL
200mA
TO
OUTPUT
PIN
1.6V
CL
50pF
IOH
200␮A
Figure 1. Load Circuit for Digital Output Timing Specifications
REV. C
–3–
AD7823
PIN FUNCTION DESCRIPTIONS
Pin No.
Mnemonic
Description
1
CONVST
2
3
4
5
6
7
8
VIN+
VIN–
GND
VREF
DOUT
SCLK
VDD
Convert Start. Falling edge puts the track-and-hold into hold mode and initiates a conversion.
A rising edge on the CONVST pin enables the serial port of the AD7823. This is useful in
multipackage applications where a number of devices share the same serial bus. The state of
this pin at the end of conversion also determines whether the part is powered down or not.
See Operating Modes section of this data sheet.
Positive input of the pseudo differential analog input.
Negative input of the pseudo differential analog input.
Ground reference for analog and digital circuitry.
External reference is connected here.
Serial data is shifted out on this pin.
Serial Clock. An external serial clock is applied here.
Positive Supply Voltage 2.7 V to 5.5 V.
PIN CONFIGURATION
DIP/SOIC/microSOIC
CONVST 1
VIN+ 2
8 VDD
AD7823
7 SCLK
TOP VIEW 6 D
VIN– 3
OUT
(Not to Scale)
5 VREF
GND 4
www.BDTIC.com/ADI
–4–
REV. C
AD7823
TERMINOLOGY
Signal to (Noise + Distortion) Ratio
This is the measured ratio of signal to (noise + distortion) at the
output of the A/D converter. The signal is the rms amplitude of
the fundamental. Noise is the rms sum of all nonfundamental
signals up to half the sampling frequency (fS/2), excluding dc.
The ratio is dependent upon the number of quantization levels
in the digitization process; the more levels, the smaller the
quantization noise. The theoretical signal to (noise + distortion)
ratio for an ideal N-bit converter with a sine wave input is
given by:
Signal to (Noise + Distortion) = (6.02N + 1.76) dB
Thus for an 8-bit converter, this is 50 dB.
Total Harmonic Distortion
Total harmonic distortion (THD) is the ratio of the rms sum of
harmonics to the fundamental. For the AD7823 it is defined as:
THD (dB) = 20 log
2
V2
2
+V3
2
+V4
2
+V5
2
+ V6
V1
where V1 is the rms amplitude of the fundamental and V2, V3,
V4, V5 and V6 are the rms amplitudes of the second through the
sixth harmonics.
Peak Harmonic or Spurious Noise
Peak harmonic or spurious noise is defined as the ratio of the
rms value of the next largest component in the ADC output
spectrum (up to fS/2 and excluding dc) to the rms value of
the fundamental. Normally, the value of this specification is
determined by the largest harmonic in the spectrum, but for
parts where the harmonics are buried in the noise floor, it
will be a noise peak.
The AD7823 is tested using the CCIF standard where two input
frequencies near the top end of the input bandwidth are used.
In this case, the second and third order terms are of different
significance. The second order terms are usually distanced in
frequency from the original sine waves while the third order
terms are usually at a frequency close to the input frequencies.
As a result, the second and third order terms are specified separately. The calculation of the intermodulation distortion is as
per the THD specification where it is the ratio of the rms sum of
the individual distortion products to the rms amplitude of the
fundamental expressed in dBs.
Relative Accuracy
Relative accuracy or endpoint nonlinearity is the maximum
deviation from a straight line passing through the endpoints of
the ADC transfer function.
Differential Nonlinearity
This is the difference between the measured and the ideal
1 LSB change between any two adjacent codes in the ADC.
Offset Error
This is the deviation of the first code transition (0000 . . . 000)
to (0000 . . . 001) from the ideal, i.e., AGND + 1 LSB.
Gain Error
This is the deviation of the last code transition (1111 . . . 110)
to (1111 . . . 111) from the ideal (i.e., VREF – 1 LSB) after the
offset error has been adjusted out.
Track/Hold Acquisition Time
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Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and
fb, any active device with nonlinearities will create distortion
products at sum and difference frequencies of mfa ± nfb where
m, n = 0, 1, 2, 3, etc. Intermodulation terms are those for which
neither m nor n are equal to zero. For example, the second
order terms include (fa + fb) and (fa – fb), while the third order
terms include (2fa + fb), (2fa – fb), (fa + 2fb) and (fa – 2fb).
Track/hold acquisition time is the time required for the output
of the track/hold amplifier to reach its final value, within
± 1/2 LSB, after the end of conversion (the point at which the
track/hold returns to track mode). It also applies to situations
where there is a step input change on the input voltage applied
to the VIN+ input of the AD7823. It means that the user must
wait for the duration of the track/hold acquisition time, after the
end of conversion or after a step input change to VIN, before
starting another conversion to ensure that the part operates to
specification.
Typical Performance Characteristics
10
0
–10
–20
AD7823
2048 POINT FFT
SAMPLING 136.054
fIN 29.961
–30
POWER – mW
0
dBs
–40
–50
–60
0.1
–70
–80
0
10
20
30
THROUGHPUT – kSPS
40
–100
50
FREQUENCY BINS
Figure 2. Power vs. Throughput
REV. C
1
23
45
67
89
111
133
155
177
199
221
243
265
287
309
331
353
375
397
419
441
463
485
507
529
551
573
595
617
639
661
683
705
727
749
771
793
815
837
859
881
903
925
947
969
991
1013
–90
0.01
Figure 3. AD7823 SNR
–5–
AD7823
SUPPLY
2.7V TO 5.5V
CIRCUIT DESCRIPTION
Converter Operation
The AD7823 is a successive approximation analog-to-digital
converter based around a charge redistribution DAC. The ADC
can convert analog input signals in the range 0 V to VDD. Figures
4 and 5 below show simplified schematics of the ADC. Figure 4
shows the ADC during its acquisition phase. SW2 is closed and
SW1 is in Position A; the comparator is held in a balanced condition; and the sampling capacitor acquires the signal on VIN+.
10␮F
TWO-WIRE
SERIAL
INTERFACE
0.1␮F
VDD
0V TO VREF
INPUT
VREF
VIN+
SCLK
AD7823
VIN–
␮C/␮P
DOUT
CONVST
AGND
Figure 6. Typical Connection Diagram
VIN+
SAMPLING
CAPACITOR
A
VIN–
ACQUISITION
PHASE
Figure 7 shows an equivalent circuit of the analog input structure of the AD7823. The two diodes, D1 and D2, provide ESD
protection for the analog inputs. Care must be taken to ensure
that the analog input signal never exceeds the supply rails by
more than 200 mV. This will cause these diodes to become
forward biased and start conducting current into the substrate.
The maximum current these diodes can conduct without causing irreversible damage to the part is 20 mA. The capacitor C2
is typically about 4 pF and can be primarily attributed to pin
capacitance. The resistor R1 is a lumped component made up of
the on resistance of a multiplexer and a switch. This resistor is
typically about 125 Ω. The capacitor C1 is the ADC sampling
capacitor and has a capacitance of 3.5 pF.
CONTROL
LOGIC
SW1
B
Analog Input
CHARGE
REDISTRIBUTION
DAC
SW2
COMPARATOR
CLOCK
OSC
VDD /3
Figure 4. ADC Acquisition Phase
When the ADC starts a conversion (see Figure 5) SW2 will
open, and SW1 will move to Position B causing the comparator
to become unbalanced. The control logic and the charge redistribution DAC are used to add and subtract fixed amounts of
charge from the sampling capacitor in order to bring the comparator back into a balanced condition. When the comparator
is rebalanced, the conversion is complete. The control logic
generates the ADC output code. Figure 11 shows the ADC
transfer function.
VDD
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VIN+
B
VIN–
CONVERSION
PHASE
D2
CONVERT PHASE – SWITCH OPEN
ACQUISITION PHASE – SWITCH CLOSED
Figure 7. Equivalent Analog Input Circuit
SW2
The analog input of the AD7823 is made up of a pseudo differential pair, VIN+ pseudo differential with respect to VIN–. The
signal is applied to VIN+ but in the pseudo differential scheme
the sampling capacitor is connected to VIN– during conversion—
see Figure 8. This input scheme can be used to remove offsets
that exist in a system. For example, if a system had an offset of
0.5 V, the offset could be applied to VIN– and the signal applied
to VIN+. This has the effect of offsetting the input span by 0.5 V.
It is only possible to offset the input span when the reference voltage (VREF) is less than VDD – VOFFSET.
COMPARATOR
VDD/3
C1
3.5pF
VDD /3
C2
4pF
CONTROL
LOGIC
SW1
R1
125⍀
VIN+
CHARGE
REDISTRIBUTION
DAC
SAMPLING
CAPACITOR
A
D1
CLOCK
OSC
Figure 5. ADC Conversion Phase
TYPICAL CONNECTION DIAGRAM
Figure 6 shows a typical connection diagram for the AD7823.
The serial interface is implemented using two wires; the rising
edge of CONVST enables the serial interface—see Serial
Interface section for more details. VREF is connected to a well
decoupled VDD pin to provide an analog input range of 0 V to
VDD. When VDD is first connected, the AD7823 powers up in
a low current mode, i.e., power-down. A rising edge on the
CONVST input will cause the part to power up—see Operating
Modes. If power consumption is of concern, the automatic powerdown at the end of a conversion should be used to improve
power performance. See Power vs. Throughput Rate section of
the data sheet.
CHARGE
REDISTRIBUTION
DAC
SAMPLING
CAPACITOR
COMPARATOR
VIN+
VIN(+)
CONVERSION
PHASE
VOFFSET
VIN–
VOFFSET
VDD/3
CONTROL
LOGIC
SW2
CLOCK
OSC
Figure 8. Pseudo Differential Input Scheme
–6–
REV. C
AD7823
When using the pseudo differential input scheme the signal on
VIN– must not vary by more than a 1/2 LSB during the conversion process. If the signal on VIN– varies during conversion, the
conversion result will be incorrect. For single ended operation, VIN–
is always connected to AGND. Figure 9 shows the AD7823 pseudo
differential input being used to make a unipolar dc current measurement. A sense resistor is used to convert the current to a
voltage, and the voltage is applied to the differential input as
shown.
VDD
VIN+
RSENSE
AD7823
For small values of source impedance, the settling time associated
with the sampling circuit (100 ns) is, in effect, the acquisition
time of the ADC. For example, with a source impedance (R2)
of 10 Ω, the charge time for the sampling capacitor is approximately 2 ns. The charge time becomes significant for source
impedances of 4.6 kΩ and greater.
AC Acquisition Time
In ac applications it is recommended to always buffer analog
input signals. The source impedance of the drive circuitry must
be kept as low as possible to minimize the acquisition time of
the ADC. Large values of source impedance will cause the THD
to degrade at high throughput rates. In addition, better performance can generally be achieved by using an external 1 nF
capacitor on VIN+.
VIN–
ADC TRANSFER FUNCTION
RL
Figure 9. DC Current Measurement Scheme
DC Acquisition Time
The output coding of the AD7823 is straight binary. The designed
code transitions occur at successive integer LSB values (i.e.,
1 LSB, 2 LSBs, etc.). The LSB size is = VREF/256. The ideal transfer characteristic for the AD7823 is shown in Figure 11 below.
The ADC starts a new acquisition phase at the end of a conversion and ends on the falling edge of the CONVST signal. At the
end of a conversion there is a settling time associated with the
sampling circuit. This settling time lasts approximately 100 ns.
The analog signal on VIN+ is also being acquired during this
settling time; therefore, the minimum acquisition time needed is
approximately 100 ns.
111...111
111...110
ADC CODE
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Figure 10 shows the equivalent charging circuit for the sampling
capacitor when the ADC is in its acquisition phase. R2 represents
the source impedance of a buffer amplifier or resistive network;
R1 is an internal multiplexer resistance and C1 is the sampling
capacitor.
111...000
011...111
1LSB = VREF/256
000...010
000...001
R2
VIN+
000...000
0V 1LSB
R1
125⍀
ANALOG INPUT
C1
3.5␮F
Figure 11. Transfer Characteristic
Figure 10. Equivalent Sampling Circuit
During the acquisition phase, the sampling capacitor must be
charged to within a 1/2 LSB of its final value. The time it takes
to charge the sampling capacitor (tCHARGE) is given by the following formula:
tCHARGE = 6.2 × (R2 + 125 Ω) × 3.5 pF
REV. C
+VREF –1LSB
–7–
AD7823
POWER-UP TIMES
OPERATING MODES
Mode 1 Operation (High Speed Sampling)
The AD7823 has a 1.5 µs power-up time. When VDD is first
connected, the AD7823 is in a low current mode of operation.
In order to carry out a conversion, the AD7823 must first be
powered up. The ADC is powered up by a rising edge on the
CONVST pin. A conversion is initiated on the falling edge of
CONVST. Figure 12 shows how to power up the AD7823 when
VDD is first connected or after the AD7823 is powered down
using the CONVST pin.
When the AD7823 is used in this mode of operation, the part is
not powered down between conversions. This mode of operation allows high throughput rates to be achieved. The timing
diagram in Figure 14 shows how this optimum throughput rate
is achieved by bringing the CONVST signal high before the end
of the conversion. It is recommended that the CONVST signal
should go high within 3 µs of conversion starting. This ensures
that the CONVST signal does not go high at the same time the
part is attempting to power down. The AD7823 leaves its tracking
mode and goes into hold on the falling edge of CONVST. A
conversion is also initiated at this time and takes 4 µs typ to
complete. At this point, the result of the current conversion is
latched into the serial shift register, and the state of the CONVST
signal is checked. The CONVST signal should be high at the
end of the conversion to prevent the part from powering down.
Care must be taken to ensure that the CONVST pin of the
AD7823 is logic low when VDD is first applied.
MODE 1 (CONVST IDLES HIGH)
VDD
tPOWER-UP
1µs
1.5␮s
CONVST
MODE 2 (CONVST IDLES LOW)
VDD
t1
tPOWER-UP
CONVST
1.5␮s
t2
CONVST
A
B
SCLK
Figure 12. Power-Up Times
DOUT
POWER VS. THROUGHPUT RATE
By operating the AD7823 in Mode 2, the average power consumption of the AD7823 decreases at lower throughput rates.
Figure 13 shows how the automatic power-down is implemented
using the CONVST signal to achieve the optimum power performance for the AD7823. The AD7823 is operated in Mode 2.
As the throughput rate is reduced, the device remains in its
power-down state for longer, and the average power consumption over time drops accordingly.
CURRENT CONVERSION
RESULT
Figure 14. Mode 1 Operation Timing
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The serial port on the AD7823 is enabled on the rising edge of
the CONVST signal–see Serial Interface section. As explained
earlier, this rising edge should occur before the end of the conversion process if the part is not to be powered down. A serial
read can take place at any stage after the rising edge of CONVST.
If a serial read is initiated before the end of the current conversion process (i.e., at time “A”), then the result of the previous
conversion is shifted out on the DOUT pin. It is possible to allow
the serial read to extend beyond the end of a conversion. In this
case, the new data will not be latched into the output shift register until the read has finished. If the user waits until the end of
the conversion process, i.e., 4 µs typ after falling edge of CONVST
(Point “B”), before initiating a read, the current conversion
result is shifted out.
t CONVERT
t POWER-UP
1.5␮s
5␮s
POWER-DOWN
CONVST
t CYCLE
100␮s @ 10kSPS
Figure 13. Automatic Power-Down
For example, if the AD7823 is operated in a continuous sampling
mode with a throughput rate of 10 kSPS, the power consumption
is calculated as follows. The power dissipation during normal
operation is 10.5 mW, VDD = 3 V. If the power-up time is 1.5 µs
and the conversion time is 5 µs, then the AD7823 can be said to
dissipate 10.5 mW for 6.5 µs (worst case) during each conversion cycle. If the throughput rate is 10 kSPS, the cycle time is
100 µs, and the average power dissipated during each cycle is
(6.5/100) × (10.5 mW) = 683 µW. Figure 2 shows a graph of
Power vs. Throughput.
–8–
REV. C
AD7823
high for 1.5 µs after the rising edge before bringing it low to
initiate a conversion. If the CONVST signal goes low before
1.5 µs in time has elapsed, the power-up time is timed out internally and a conversion is initiated. Hence the AD7823 is guaranteed to have always powered up before a conversion is initiated—
even if the CONVST pulsewidth is <1.5 µs. If the CONVST
width is >1.5 µs a conversion is initiated on the falling edge.
Mode 2 Operation (Automatic Power-Down)
When used in this mode of operation, the part automatically
powers down at the end of a conversion. This is achieved by
leaving the CONVST signal low until the end of the conversion.
The timing diagram in Figure 15 shows how to operate the part
in this mode. If the AD7823 is powered down, the rising edge of
the CONVST pulse causes the part to power up. When the part
has powered up (≈ 1.5 µs after the rising edge of CONVST), the
CONVST signal is brought low, and a conversion is initiated
on this falling edge of the CONVST signal. The conversion
takes 5 µs max and after this time, the conversion result is latched
into the serial shift register and the part powers down. Therefore,
when the part is operated in Mode 2, the effective conversion
time is equal to the power-up time (1.5 µs) and the SAR conversion time (5 µs), i.e., 6.5 µs.
SERIAL INTERFACE
The serial interface of the AD7823 consists of three wires, a
serial clock input SCLK, serial port enable CONVST and a
serial data output DOUT, see Figure 16 below. The serial interface is designed to allow easy interfacing to most microcontrollers,
e.g., PIC16C, PIC17C, QSPI and SPI, without the need for any
gluing logic. When interfacing to the 8051, the SCLK must be
inverted. The “Microprocessor Interface” section explains how
to interface to some popular microcontrollers.
As in the case of Mode 1 operation, the rising edge of the
CONVST pulse enables the serial port of the AD7823—see
Serial Interface section. If a serial read is initiated soon after this
rising edge (Point “A”), i.e., before the end of the conversion,
then the result of the previous conversion is shifted out on pin
DOUT. In order to read the result of the current conversion, the
user must wait at least 5 µs max after the falling edge of CONVST
before initiating a serial read. The serial port of the AD7823 is
still functional even though the AD7823 has been powered
down. Note: A serial read should not cross the reset rising edge
of CONVST.
Figure 16 shows the timing diagram for a serial read from the
AD7823. The serial interface works with both a continuous and
a noncontinuous serial clock. The rising edge of the CONVST
signal RESETS a counter, which counts the number of serial
clocks to ensure the correct number of bits are shifted out of the
serial shift registers. The SCLK is ignored once the correct
number of bits have been shifted out. In order for another serial
transfer to take place, the counter must be reset by the falling
edge of the eighth SCLK. Data is clocked out from the DOUT
line on the first rising SCLK edge after the rising edge of the
CONVST signal and on subsequent SCLK rising edges. The
DOUT pin goes back into a high impedance state on the falling
edge of the eighth SCLK. In multipackage applications, the
CONVST signal can be used as a chip select signal. The serial
interface will not shift data out until it receives a rising edge on
the CONVST pin.
Because it is possible to do a serial read from the part while it is
powered down, the AD7823 is powered up only to do the conversion and is immediately powered down at the end of a conversion.
This significantly improves the power consumption of the part
at slower throughput rates—see Power vs. Throughput Rate
section.
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Note: Although the AD7823 takes 1.5 µs to power up after
the rising edge of CONVST, it is not necessary to leave CONVST
t POWER-UP
t1
1.5␮s
CONVST
SCLK
B
A
CURRENT CONVERSION
RESULT
DOUT
Figure 15. Mode 2 Operation Timing
t3
SCLK
1
2
3
4
5
6
7
8
t4
t5
CONVST
t7
t8
t6
DOUT
DB7
DB6
DB5
DB4
DB3
DB2
Figure 16. Serial Interface Timing
REV. C
–9–
DB1
DB0
AD7823
MICROPROCESSOR INTERFACING
AD7823 to 8051
The serial interface on the AD7823 allows the parts to be directly
connected to a range of many different microprocessors. This
section explains how to interface the AD7823 with some of the
more common microcontroller serial interface protocols.
The AD7823 requires a clock synchronized to the serial data;
therefore, the 8051 serial interface must be operated in Mode 0.
In this mode serial data enters and exits through RXD, and a serial
clock is output on TXD (half duplex). Figure 19 shows how the
8051 is connected to the AD7823. Here, because the AD7823
shifts data out on the rising edge of the serial clock, the serial
clock must be inverted.
AD7823 to PIC16C6x/7x
The PIC16C6x Synchronous Serial Port (SSP) is configured
as an SPI Master with the Clock Polarity Bit = 0. This is done
by writing to the Synchronous Serial Port Control Register
(SSPCON). See PIC16/17 Microcontroller User Manual. Figure
17 shows the hardware connections needed to interface to the
PIC16/PIC17. In this example I/O port RA1 is being used to
pulse CONVST and enable the serial port of the AD7823.
AD7823*
AD7823*
SCK/RC3
DOUT
SDO/RC5
CONVST
RA1
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 17. Interfacing to the PIC16/PIC17
AD7823 to MC68HC11
The Serial Peripheral Interface (SPI) on the MC68HC11 is
configured for Master Mode (MSTR = 0), Clock Polarity Bit
(CPOL) = 0, and the Clock Phase Bit (CPHA) = 1. The SPI is
configured by writing to the SPI Control Register (SPCR)—see
68HC11 User Manual. A connection diagram is shown in
Figure 18.
TXD
DOUT
RXD
CONVST
P1.1
*ADDITIONAL PINS OMITTED FOR CLARITY
PIC16C6x/7x*
SCLK
8051*
SCLK
Figure 19. Interfacing to the 8051 Serial Port
It is possible to implement a serial interface using the data ports
on the 8051 (or any microcontroller). This would allow direct
interfacing between the AD7823 and 8051 to be implemented
without the need for any “gluing” logic. The technique involves
“bit banging” an I/O port (e.g., P1.0) to generate a serial clock
and using another I/O port (e.g., P1.1) to read in data, see
Figure 20.
AD7823*
8051*
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AD7823*
MC68HC11*
SCLK
SCLK/PD4
DOUT
MISO/PD2
CONVST
SCLK
P1.0
DOUT
P1.1
CONVST
P1.2
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 20. Interfacing to the 8051 Using I/O Ports
PA0
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 18. Interfacing to the MC68HC11
–10–
REV. C
AD7823
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
0.430 (10.92)
0.348 (8.84)
8
5
0.280 (7.11)
0.240 (6.10)
1
4
0.325 (8.25)
0.300 (7.62)
0.060 (1.52)
0.015 (0.38)
PIN 1
0.210 (5.33)
MAX
0.160 (4.06)
0.115 (2.93)
0.022 (0.558) 0.100 0.070 (1.77)
0.014 (0.356) (2.54) 0.045 (1.15)
BSC
0.195 (4.95)
0.115 (2.93)
0.130
(3.30)
MIN
C01322a–0–10/00 (rev. C)
8-Lead Plastic DIP
(N-8)
0.015 (0.381)
0.008 (0.204)
SEATING
PLANE
8-Lead Small Outline Package
(SO-8)
0.1968 (5.00)
0.1890 (4.80)
0.1574 (4.00)
0.1497 (3.80)
8
5
1
4
0.2440 (6.20)
0.2284 (5.80)
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PIN 1
0.0098 (0.25)
0.0040 (0.10)
SEATING
PLANE
0.0688 (1.75)
0.0532 (1.35)
0.0196 (0.50)
x 45ⴗ
0.0099 (0.25)
0.0500 0.0192 (0.49)
(1.27) 0.0138 (0.35) 0.0098 (0.25)
BSC
0.0075 (0.19)
8ⴗ
0ⴗ
0.0500 (1.27)
0.0160 (0.41)
8-Lead microSOIC Package
(RM-8)
0.122 (3.10)
0.114 (2.90)
8
0.122 (3.10)
0.114 (2.90)
5
0.199 (5.05)
0.187 (4.75)
1
4
0.0256 (0.65) BSC
0.120 (3.05)
0.112 (2.84)
0.120 (3.05)
0.112 (2.84)
0.006 (0.15)
0.002 (0.05)
0.018 (0.46)
SEATING 0.008 (0.20)
PLANE
REV. C
0.043 (1.09)
0.037 (0.94)
0.011 (0.28)
0.003 (0.08)
–11–
33ⴗ
27ⴗ
0.028 (0.71)
0.016 (0.41)
PRINTED IN U.S.A.
PIN 1
Fly UP